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Prof. Aicha Elshabini

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A. Elshabini has contributed to more than 270 technical articles, 120 Journal articles, more than 150 technical papers in International Conferences, three (3) Handbooks, and numerous invited presentations. Sample included

  1. “Ceramic Interconnect Technology Handbook”, Fred Barlow and Aicha Elshabini, CRC Press, Taylor & Francis Group, 2007.
  2.  

  3. “An Interdigital  Bandpass Filter Embedded in LTCC for 5 GHz Wireless LAN Applications”, Gangqiang Wang, Minh Van, Fred Barlow, and Aicha Elshabini, IEEE Microwave and Wireless Components  Letters, Vol. 15, No. 5, pp. 357-359, 2005.
  4.  

  5. “Simulation studies in both the Frequency and Time Domain of InGaAsP Photodetectors”, A. Elshabini, IEEE Trans.  on  Electron  Devices, Vol. ED-27, No. 5, pp. 1000-1003, 1980.
  6.  

  7. “Time Domain Simulation Analysis of Avalanche Photodetectors”, A. Elshabini, IEEE Trans.  on Electron Devices, Vol. ED-29, No. 6, 1982.
  8.  

  9. “Analytical Model for Leakage Current in InGaAsP Avalanche Photodiodes”, A. Elshabini and J. He, Solid State Electronics, Vol. 31, No. 9, 1988.
  10.  

  11. “Wideband Measurement of Complex Permittivity of Dielectric Materials Using Wideband Cavity”, A. Elshabini, IEEE Trans. on Instrumentation and Measurements, Vol. 38, No. 2, 1989.
  12.  

  13. “An Enhanced Time Domain Approach For Dielectric  Characterization Using Stripline Geometry”, K.M. Fidanboylu, S.M. Riad, and A. Elshabini, IEEE Transactions on Instrumentation and Measurements, Vol.  41, No. 1, pp. 132-136, Feb. 1992.
  14.  

  15. “A 200 MHz, Fourth Order, Q-Enhanced, LC Bandpass Filter”, W. B. Kuhn, F.W. Stephenson, and A. Elshabini, IEEE Journal of Solid-State Circuits, Vol. 34, No. 8, 11 pages, 1999.
  16.  

  17. “Handbook of Thin Film Technology”, Editors; A. Elshabini and F. Barlow, McGraw-Hill, 1998.
  18.  

  19. “Thermal Interactions of Semiconductor Devices on Copper  Clad Ceramic Substrates”, M. Hussein, D. Nelson, and A. Elshabini, IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (CHMT), Vol. 15, No. 5, pp. 651-657, Oct. 1992.
  20.  

  21. “Permeability Evaluation of Ferrite Pastes, Epoxies, and Substrates  Over a Wide Range of Frequencies”, M. Riahikashani and A. Elshabini, IEEE Trans. on           Instrumentation and Measurements, Vol. 41, No. 6, pp. 106-110, Dec. 1992.
  22.  

  23. “Crosstalk Analysis of Multisection Multiconductor  Lines”, W. Su, S.M. Riad, A. Elshabini, and T. Poulin, IEEE Trans. on  Instrumentation and Measurements, Vol. 42, No. 6, Dec. 1992.
  24.  

  25. “Dielectric Loss Determination Using  Perturbation”, M.Y. Andrawis, W. Davis, S.M. Riad, and A. Elshabini,  IEEE Transaction on Instrumentation and Measurements, Vol. 42, No. 6, Dec. 1992.
  26.  

  27. “Measurements, Modeling, and Simulation of Electronic Packages”, I. Bhutta, A. Elshabini, and S. M. Riad, The International Journal of Microcircuits and Electronic Packaging, Volume 16, Number 2, pp. 161-166, 1993.
  28.  

  29. “Time Domain Techniques Applied to Measurements and Modeling of Microwave Packages”, I. Bhutta, S.M. Riad, and A. Elshabini, published in the Microwave Hybrids Conference, Arizona, Oct. 1993.
  30.  

  31. “Plastic Package Modeling and Characterization at RF/Microwave Frequencies For RFIC Devices”, S. M. Riad, I. Salama, W. Su, and A. Elshabini, Virginia Tech, and M. Rachlin, Walter (Greg) Baker, and J. Perdue, ITT GTC, Advancing Microelectronics, Vol. 24, No. 4, pp. 41 - 46, 1997.
  32.  

  33. “Nonlinear Thermal Stress and Flow Modeling in Various Electronic Packages”, R. Panneer Selvam and A. Elshabini, Invited Publication, The International Journal of Microcircuits and Electronic Packaging, Issue 2, Vol. 23, No. 2, pp. 224 – 233, 2000.
  34.  

  35. “Interfacial Thermal Resistance and Temperature Dependence of Three Adhesives for Electronic Packaging”, D. P. H. Hasselman, K. Y. Donaldson, F. D. Barlow, A. A. Elshabini, G. H. Schiroky, J. P. Yaskoff, and R. L. Dietz, IEEE Transactions On Components and Packaging Technologies, Volume 23, Number 04,  pp. 633-637, December 2000.
  36.  

  37. “A Combined Octant/Delaunay Method for Fully Automatic 3D Mesh Generation with Multiple Level Octant Differences”, R. Marchand, S. Riad, and A. Elshabini, Communications in Numerical Methods in Engineering, Vol. 12, No. 3, pp. 343-349, 1996.
  38.  

  39. “Fundamental Issues in Processing & Applications of Low Temperature Cofired Ceramic Tape”, A. Elshabini, G. Wang, F. Barlow, E. Elvey, & M. Folk, XXVIII International Conference of IMAPS Poland Chapter, Invited Presentation, Wroclaw, 26-29 Sept 2004.
  40.  

  41. “LTCC Based Slow Wave Filters For Wireless and Handheld Products”, F. Magableh, V. Wang, F. Barlow, A. Elshabini, IMAPS Ceramics Conference 2003, April 2003, Denver Co.
  42.  

  43. “Low Temperature Cofired Ceramics”, F. Barlow & A. Elshabini, Chapter 7, Handbook of Ceramic Interconnect Technology, F. Barlow & A. Elshabini editors, to be published 2004, Marcel Dekker Inc., NY, NY.
  44.  

  45. “Packaging of High-Speed and Microwave Electronic Systems”, A. Elshabini, F. Barlow, Chapter 12, Electronic Packaging and Interconnection Handbook, Fourth Edition, edited by, Charles A. Harper, McGraw Hill, to be published in 2005.
  46.  

  47. "Design Guidelines for Thin Film Components and Construction of Thin Film Modules", A. Elshabini, F. Barlow, Chapter IV, Thin Film Technology Handbook, edited by, A. Elshabini and F. Barlow, McGraw Hill, 1998.
  48.  

  49. Thin Film Technology Handbook, edited by, A. Elshabini and F. Barlow, McGraw Hill, 1998.
  50.  

  51. The Encyclopedia of Materials: Science and Technology, Chapter 6.10.4 “Electronic Packaging: Semiconductor Packages”, A. Elshabini & F. Barlow, Elsiever Science, Oxford, UK, 2001.
  52.  

  53. “Ceramic Substrates”, A. Elshabini, F. Barlow, Chapter 5, Advanced Electronic Packaging, Second Edition, edited by, William D. Brown, IEEE Press, published in 2004.
  54.  

  55. The Encyclopedia of Materials: Science and Technology, Chapter 6.10.4 “Electronic Packaging: Semiconductor Packages”, A. Elshabini & F. Barlow, Elsiever Science, Oxford, UK, 2001.
  56.  

  57. Fred Barlow, Jared Wood, Aicha Elshabini, Edward F. Stephens, Ryan Feeler, Greg Kemner, Jeremy Junghans, “Fabrication of Precise Fluidic Structures in LTCC”, International Journal of Applied Ceramic Technology, Volume 6, No. 1, 2009, pp. 18-23.
  58.  

  59. Wang, G., E. Elvey, F. Barlow, and A. Elshabini, “Fabrication of Micro Vias for LTCC Substrates,” IEEE Transactions on Electronics Packaging Manufacturing, Volume 29, Issue 1, Jan. 2006, Page(s):32 – 41
  60.  

  61. .“Getting Aggressive with Passive Devices”, R. K. Ulrich, W. D. Brown, S. S. Ang, F. Barlow, A. Elshabini, T. G. Lenihan, H. A. Naseem, D. Nelms, J. Parkerson, L. W. Schaper, and G. Morcan, IEEE Circuits & Devices, vol. 16, no. 5, pp. 16-25, September 2000.
  62.  

  63. "Numerical Simulation of a Back Grinding Process for Silicon Wafers", A.H. Abdelnaby, G.P. Potirniche, F. Barlow, B. Poulsen, A. Elshabini, R. Parker, T. Jiang, The American Ceramic Society's Ceramic Transactions volume (from the MS&T'10 meeting).
  64.  

  65. 4. “Develop Procedure for Designing Fourth Order Microstrip Dual-Mode Bandpass Filters”, Rabeea, A.A.; Barlow, F.; Elshabini, A.; 2010 Microwave Mediterranean Symposium (MMS), Guzelyurt, Northern Cyprus, August 25-27, 2010, Page(s): 236 – 240.
  66.  

  67. “Design Methodology for Designing Second Order Microstrip Dual-Mode Filters”, Abdulla A. Rabeea, Fred Barlow, and Aicha Elshabini, Proceedings of the Mediterranean Microwave Symposium, November 15-17, 2009, Tangiers, Morocco
  68.  

  69. “Encapsulation of Power Modules for Extreme Environments”, Gona Rao, Srikanth Kulkarni, Fred Barlow, and Aicha Elshabini, accepted the Proceedings of the 2009 International Microelectronics and Packaging Conference, San Jose, CA, November 2009.
  70.  

  71. “SiC & GaN Die Attach for Extreme Environment Electronics”, Srikanth Kulkarni, Fred Barlow, Aicha Elshabini, and Rick Edgeman, Proceedings of the 2008 International Microelectronics and Packaging Conference, Providence, RI, November 2008, pp. 1119-1125.
  72.  

  73. “Leakage Rates through LTCC Substrates for Extreme Environment Applications”, Karl Rink, Fred Barlow, and Aicha Elshabini, Proceedings of the 2008 International Microelectronics and Packaging Conference, Providence, RI, November 2008, pp 1147-1151.
  74.  

  75. “Fabrication of Precise Fluidic Structures in LTCC”, Fred Barlow, Jared Wood, and Aicha Elshabini, Edward F. Stephens, Ryan Feeler, Greg Kemner, Jeremy Junghans, Proceedings of the Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) 2008 conference, April 2008, Munich, Germany, pp. 183-188.
  76.  

  77. “Advanced Laser Diode Cooling Concepts”, Ryan Feeler, Jeremy Junghans, Greg Kemner, Ed Stephens, Fred Barlow, Aicha Elshabini and Jared Wood, 2008 MRS Spring MeetingSan Francisco, Ca, March 24-28
  78.  

  79.  “Micro-fluidic Optoelectronic Packages based on LTCC”, Edward F. Stephens, Ryan Feeler, Greg Kemner, Fred Barlow, Jared Wood, and Aicha Elshabini, Proceedings of the 2007 International Microelectronics and Packaging Conference, San Jose, CA, November 2007, pp. 429-436.
  80.  

  81. “High-Temperature SiC Packaging For HEV Traction Applications”, K. Vanam, F. Barlow, B. Ozpineci, L. D. Marlino, M. S. Chinthavali, L. M. Tolbert, and A. Elshabini, Proceedings of the 2007 International Microelectronics and Packaging Conference, San Jose, CA, November 2007.
  82.  

  83. “Investigation of the Via fill Process for High Density Multilayer LTCC Substrates”, Brian Rowden, Gangqiang Wang, Fred Barlow, Aicha Elshabini, Larry Zawicki, Gregg Barner, Brent Duncan, Dan Krueger, Cristie Lopez, Proceedings of the 2006 International Microelectronics and Packaging Conference, San Diego, CA, October 2006.
  84.  

  85. “Low Temperature Co-Fired Ceramics in Electrochemical Applications”, I. Fritsch, Eyitayo Fakunle, Prabhu Arumugam, Padhmodhbhava Yoga Narasimhan, Melissa Weston, Emily Anderson, Gangqiang Wang, Fred Barlow, 209th ECS Meeting, May 7-May 12, 2006, Denver, Colorado.
  86.  

  87. “Interconnection of Fine Lines to Micro Vias in High Density Multilayer LTCC Substrates”, Gangqiang Wang, Fred Barlow, and Aicha Elshabini, Proceedings of the 2005 International Microelectronics and Packaging Conference, Philadelphia, Pennsylvania, September 2005.
  88.  

  89. “Future Trends in Electronic Packaging”, Aicha Elshabini, Gangqiang Wang, and Fred Barlow, Proceedings of SPIE Volume: 6172, Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology, Editor(s): Vijay K. Varadan.
  90.  

  91. “Computer Modeling of Liquid Droplet Impact on Heat Transfer During Spray Cooling”, R. Panneer Selvam, Sandya Bhaskara, Juan Balda, Fred Barlow and Aicha Elshabini, Proceedings of the ASME Summer 2005 Heat Transfer Conference (HT2005), San Francisco, CA, 2005.
  92.  

  93. “Integrated motors and controllers for 42 V automotive auxiliary motor applications”, Rowden, B.; Barlow, F.; Balda, J.; Elshabini, A.; Garcia, G.; Leidhold, R.; De Angelo, C.; Bossio, G.; Forchetti, D., Power Electronics in Transportation, 2004, pp.97 – 102
  94.  

  95. “A novel packaging methodology for spray cooling of power semiconductor devices using dielectric liquids”, Vanam, K.; Junghans, J.; Barlow, F.; Selvam, R.P.; Balda, J.C.; Elshabini, A.;Applied Power Electronics Conference and Exposition, 2005. APEC 2005. Twentieth Annual IEEE, Volume 3,  6-10 March 2005, pp.2014 – 2018.
  96.  

  97. “Modeling-based design optimization of wafer-level and chip-scale packaging for RF-MEMS devices”, Kelley, M.; Malshe, A.P.; Barlow, F., Electronic Components and Technology, 2005. ECTC '05. Proceedings, May 31-June 3, 2005, pp. 1814 – 1818.
  98.  

  99. “Embedded Passives in LTCC for RF & Microwave Applications”, G. Wang, M. Folk, A. Elshabini, & F. Barlow, European Microelectronics and Packaging Symposium, Prague 16th & 18th June 2004, Czech Republic.
  100.  

  101. “LTCC Based Front-End receiver for 5-GHz WLAN Applications”, Minh Van, F. Barlow, V. Wang, A. Elshabini, IMAPS Ceramics Conference 2004, April 26-28, 2004, Denver Co.
  102.  

  103. “Fundamental Issues in processing and Applications of Low Temperature Cofired ceramic Tape”, A. Elshabini, G. Wang, F. Barlow, E. Elvey, & M. Folk, Proceedings of the XXVIII International Conference of IMAPS Poland Chapter, pp. 19-29, Wroclaw, 26-29 September 2004.
  104.  

  105. “Micro Vias In LTCC Substrates”, G. Wang, E. Elvey, F. Barlow, A. Elshabini, IMAPS 2004 proceedings, November 14-18, 2004, Long Beach, CA.
  106.  

  107. “Die Attach for High Temperature SiC Devices”, J. Junghans, A. Elshabini, F. Barlow, and G. Wang, IMAPS International Conference on High Temperature Electronics (HiTEC 2004), May 17-20, 2004, Santa Fe, NM.
  108.  

  109. “Modeling and control of resistance tolerance for embedded resistors in LTCC”, Wang, G.; Barlow, F.; Elshabini, A, Electronic Components and Technology Conference, 2002. Proceedings. 52nd, 28-31 May 2002, pp. 516 – 525.
  110.  

  111. “Some Considerations in High Power Motor Drive Systems for Ship Propulsion”, Y. Wei, J, Junghans, J. Balda, F. Barlow, A. Elshabini, Electric Machine Technology Symposium (EMTS) 2004, “The Technical and Economic Challenges of the All Electric Force”, Adam's Mark Hotel, Philadelphia, PA, January 27-29, 2004.
  112.  

  113. Wei, Y., J. Junghans, J.C. Balda, F. D. Barlow, and A. Elshabini, “Some Considerations in High Power Motor Drive Systems for Ship Propulsion,” ASME 2004, EMTS, Naval Symposium.
  114.  

  115. “Embedded Passives in LTCC for RF & Microwave Applications”, G. Wang, M. Folk, A. Elshabini, & F. Barlow, European Microelectronics and Packaging Symposium, Prague 16th & 18th June 2004, Czech Republic.
  116.  

  117. “LTCC Based Front-End receiver for 5-GHz WLAN Applications”, Minh Van, F. Barlow, V. Wang, A. Elshabini, IMAPS Ceramics Conference 2004, April 26-28, 2004, Denver, Colorado.
  118.  

  119. “A Microjet Array Air Impingement Cooling Package Fabricated using Low Temperature Cofired Ceramic”, K. Saxena, G. Wang, F. Barlow, S. Ang, and A. Elshabini, IMAPS Ceramics Conference 2004, April 26-28, 2004, Denver Co.
  120.  

  121. “Fabrication and Numerical Design of MEMS Based Silicon Micro-Jet Array Impingement Coolers”, K. Saxena, Y. Jung, S. Ang , F. Barlow, R. Selvam, and A. Elshabini, IMAPS International Conference on High Temperature Electronics (HiTEC 2004), May 17-20, 2004, Santa Fe, NM.
  122.  

  123. “Electronic Packaging Education at the University of Arkansas: Status After 10 years”. William Brown, F. Barlow, L. Schaper, R. Ulrich, ECTC 2003, Feb 3 2003, New Orleans, LA
  124.  

  125. “Alternative Z-axis connector technologies for high-density 3-D packaging”, Electronic Components and Technology Conference, 2002. Proceedings. 52nd, 28-31 May 2002 pp. 1106 – 1109.
  126.  

  127. “LTCC Based Slow Wave Filters For Wireless and Handheld Products”, F. Magableh, V. Wang, F. Barlow, A. Elshabini, IMAPS Ceramics Conference 2003, April 2003, Denver, Colorado.
  128.  

  129. “LTCC Based MEMS impingement Coolers”, K. Saxena, G. Wang, S. Ang, A. Elshabini, and F. Barlow, IMAPS Ceramics Conference 2003, April 2003, Denver Co.
  130.  

  131. “LTCC Based Slow Wave Filters For Wireless and Handheld Products”, F. Magableh, V. Wang, F. Barlow, A. Elshabini, 14th European Microelectronic & Packaging Conference 2003,  June 2003, Friedrichshafen Germany.
  132.  

  133. “LTCC Based MEMS impingement Coolers”, K. Saxena, G. Wang, S. Ang, A. Elshabini, and F. Barlow, 14th European Microelectronic & Packaging Conference 2003,  June 2003, Friedrichshafen Germany.
  134.  

  135. “Process and Material Challenges Associated with the Next generation of LTCC Based Products”, F. Barlow, V. Wang, E. Elvey, C. Tan, & A. Elshabini, Proceedings of the Electrochemical Society (ECS) Fall Meeting, Oct. 12-17, 2003, Orlando, FL.
  136.  

  137. “Embedded Passives in Low-Temperature Co-Fired Ceramic for RF & Microwave Applications”, M. Folk, V. Wang, A. Elshabini, F. Barlow, Proceedings of the 2003 International Microelectronics and Packaging Conference, Boston, MA, 2003.
  138.  

  139. “Mixed-Signal/Telecommunications Curriculum Development and Internet2 Delivery”, H. Alan Mantooth, Fred Barlow, Sean Mulvenon, Simon Ang, Proceedings of the 2002 American Society for Engineering Education Annual Conference & Exposition, American Society for Engineering Education.
  140.  

  141. “MCM- D/C Based on Cu/ BCB Thin Film and LTCC: Lessons Learned”, Fred Barlow, Michael Glover, Jeff Mincy,Errol Porter, Len Schaper, Aicha Elshabini, 2002 Proceedings of the International Symposium on Microelectronics, Denver,Colorado, September 4-6, 2002.
  142.  

  143. “Simulation, Characterization and Design of Embedded Resistors in LTCC forHigh Frequency Applications”,Gangqiang Wang, Fred D. Barlow, Aicha Elshabini, 2002 Proceedings of the International Symposium on Microelectronics, Denver,Colorado, September 4-6, 2002.
  144.  

  145. “Effect of Design and Processing Parameters on Buried Resistors in LTCC Systems”, W. Gangqiang, V. Rajagopalan, F. Barlow, A. Elshabini, S. Ang, 2001 Proceedings of the International Symposium on Microelectronics, Baltimore, Maryland, October, 2001.
  146.  

  147. “Z-axis Interconnection for 3-D High-Density Packaging”, Silke Spiesshoefer, Leonard Schaper, Kaoru Maner, Errol Porter, Fred Barlow, George Bates, Mike Lucas, Bill Marsh, University of Arkansas; Michael Glover, Northrop Grumman, 2001 Proceedings of the International Symposium on Microelectronics, Baltimore, Maryland, October, 2001.
  148.  

  149. “Integral Passives Development at The University of Arkansas: The State of the Art”, Simon Ang, Fred Barlow, William Brown, Aicha Elshabini, James Parkerson, Len Schaper, Richard Ulrich,Conference Proceedings of APEX 2000, March, 2000.
  150.  

  151. “Polymer Thick Film (PTF) and Flex Technologies for Low Cost Power Electronics Packaging”, A. B. Lostetter (Graduate Student), F. Barlow, A. Elshabini, K. Olejniczak, and S. Ang., International Workshop on Integrated Power Packaging (IWIPP), July 14-15, 2000.
  152.  

  153. “Investigation of Wirebonds on Insulated-Metal Substrate for Multichip Power Module Applications”, W. L. Ng, S. S. Ang, T. Thach, B. Ivy, F. Barlow, A. Elshabini, K. C. Burgers, K. J. Olejniczak, and W. D. Brown, Proceedings of the International Conference on Microelectronics, October 2000, pp. 99-104.
  154.  

  155. “A Micromachined Ball Grid Array Test Socket for Fine-Pitch Interconnect”, B. Huang, S. S. Ang, E. V. Porter, Q. Qiao, W. F. Schmidt, W. D. Brown, F. Barlow, A. Elshabini, Proceedings of the International Conference on Microelectronics, October 2000, pp. 172 –177.
  156.  

  157. “A flip chip power electronic packaging technology on a flexible substrate,” H. Quach, S. S. Ang, F. Barlow, A. J. Malshe, K. Olejniczak, A. Elshabini, and W. D. Brown, EPTC 2000, Singapore, December 5-7, 2000.
  158.  

  159. “Z-axis interconnections for high density processors”, Len  Schaper, F. Barlow, W. Marsh, G. Bates, M. Lucas, and P. Sangree,  Fifth VLSI Pack. Workshop of Japan, 04-06 December 2000, Kyoto, Japan.
  160.  

  161. “3D Packaging for High-Density Processing”, P. Sangree, W. Marsh, G. Bates, M. Lucas, L. Schaper, F. Barlow, K. Gray, And G. Cochrane,  GOMAC 2001.
  162.  

  163. “Curriculum restructure to answer critical needs in packaging for energy efficiency/renewable energy systems, wireless, and mixed-signal systems areas”,  W. Brown, A. Elshabini, S. Ang, J. Balda, F. Barlow, R. Couvillion, A. Malshe, R. Malstrom, A. Mantooth, T. Martin, H. Naseem, R. Jones, W. Waite, R. Brown,  N. Schmitt, D. Nutter, G. Salamo, L. Schaper, W. Schmidt, R. Selvam, S. Singh, K. Olejniczak, R. Ulrich, J. Yeargan, E. Yaz, and W. White, Proc. 50th ECTC, pp. 1278-1284, 2000.
  164.  

  165. “The Utilization of Polymer Thick Film (PTF) and Flex Technologies for Low Cost Power Electronics Packaging  of DC/DC Down Converters”, A.B. Lostetter, J. White, F. Barlow, and A. Elshabini, 1999 Proceedings of the International Symposium on Microelectronics, Chicago, October  1999.
  166.  

  167. 59.“UBM Formation on Single Die/Dice for Flip Chip Applications”, S. Jittinorasett,  F. Barlow,  J. McGrath and A. Elshabini, 1999 Proceedings of the International Symposium on Microelectronics, Chicago, October, 1999.
  168.  

  169. “A Compact Low Voltage High Current Power Supply for Digital Applications”, F. Barlow, A. Elshabini, 1998 Proceedings of the International Symposium on Microelectronics, San Diego, California, November 1-4, pp. 138- 143, 1998.
  170.  

  171. “Evaluation of a Novel Polyimide for Use as a Low-Loss, Low Dielectric Constant Interlayer in Electronic Packaging Applications”, D. L. Duson, et. al., 1998 Proceedings of the International Symposium on Microelectronics, San Diego, California, November 1-4, pp. 230-235, 1998.
  172.  

  173. “Multilayer Interconnects for a High Power Packaging Strategy”, A. Lostetter, F. Barlow, A. Elshabini, 1998 Proceedings of the International Symposium on Microelectronics, San Diego, California, November 1-4, pp. 330-334, 1998.
  174.  

  175. “Low Dielectric Constant Thick Film Silver and Gold Systems Characterization for High Frequency Ceramic Substrates”, D. Kellerman, et. al., 1998 Proceedings of the International Symposium on Microelectronics, San Diego, California, November 1-4, pp. 795-801, 1998.
  176.  

  177. "Electronic Packaging for Power Electronic Building Blocks (PEBB)", R. H. Hoagland, A.B. Lostetter, J. Webster, F.D. Barlow, D. Nelson, and A. Elshabini-Riad, Government Microcircuits Applications Conference (GOMAC), March 10-13 1997, Las Vegas, Nevada, 1997.
  178.  

  179. "Materials issues for Packaging of Power Electronic Building Blocks", A. Lostetter, J. Webster, R. Hoagland, F. Barlow, and A. Elshabini-Riad, Third International Symposium and Exhibition on Advanced Packaging Materials, Processes, Properties, and Interfaces, March 9-12, 1997, Session entitled "Ceramic Materials".
  180.  

  181. “Microelectronics and Electronic Packaging Education and Research at Virginia Tech”, IEEE-ECTC Conference (Electronic Components and Technology Conference), San Jose, May 19-25, 1997.
  182.  

  183. "Electronic Packaging of Power Electronic Building Blocks (PEBB)", F.D. Barlow, D. Nelson, and A. Elshabini-Riad, The fourteenth Annual Power Electronics Seminar, Sept. 29 - Oct. 1, 1996.  Also, Appeared in 1996 VPEC Seminar Proceedings, pp. T-9 - T-12, 1996.
  184.  

  185. "Electronic Packaging Solutions for Power Electronic Building Blocks (PEBB)", F.D. Barlow, D. Nelson, and A. Elshabini-Riad, Presented in The International Symposium on Microelectronics (ISHM '96), Session on Power Packaging and Thermal Management, ISHM '96 Proceedings, pp. 359-364, October 6-10, 1996, Minneapolis, MN.
  186.  

  187. "Underwater Digital Signal Processing Unit Implementing MCM-C Technology", F. Barlow, D. Moore, and A. Elshabini,  Proceedings of the International Conference on Multichip Modules, Denver, Colorado, April, 1995, pp. 95 - 99.
  188.  

  189. "Wideband Electrical Characterization of Materials Used in MCM  Applications", F. Barlow, S. M. Riad, W. Su, A. Elshabini ,  Paper to be published in the International Symposium of Hybrid Microelectronics (ISHM '95), Los Angeles, CA, October, 1995.
  190.  

  191. "Thick Film Cerium Oxide Buffer Layers for High Temperature Superconductors", F. Barlow, A. Elshabini, and D. Moore, Full Paper Presented in the International Symposium of Hybrid Microelectronics (ISHM '94), Boston, MA, November 14-17, 1994.  Paper also appeared in ISHM 94 Conference Proceedings, pp. 161-166, 1994.
  192.  

  193. "Materials and Processes for MCM Applications", W. Hayth-Perdue, J. Adams, F. Barlow, M. Hayes, D. Moore, S. Riad, and A. Elshabini, Full Paper Presented in the Electronic Materials and Processing (EM&P) conference, ASM International, held with ISTFA, Los Angeles, CA, November 14-16, 1994.  Paper also will appear in EM&P Conference Proceedings, 1994.
  194.  

  195. "High Frequency Characterization of Thick Film Superconductors", F. Barlow and A. Elshabini, Full Paper Presented in the 8th Electronic Materials and Processing Congress, ASM International, San Jose, CA, August 29-September 2, 1993.  Paper also appeared in EM&P/ASM conference Proceedings, pp. 27-33, 1993.
  196.  

  197. "A Novel Method for the Production of High Temperature Superconducting Multichip Modules", F. Barlow, I. Bhutta, M. Hayes, W. Su, A. Elshabini, and S. M. Riad, Full Paper Presented at the 25th Government Microcircuit Applications Conference (GOMAC), New Orleans, LA,  November 5-7, 1993.  Paper also appeared in GOMAC Proceedings, Vol. 16.8, pp. 581-584, 1993.

 

  

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